philip feng
University of Florida
Gainesville, United States
Associate Editor
Micro- and Nanoelectromechanical Systems
University of Florida
Gainesville, United States
Associate Editor
Micro- and Nanoelectromechanical Systems
Chongqing University
Chongqing, China
Associate Editor
Solid and Structural Mechanics
IDMEC, Instituto Superior TĂ©cnico, University of Lisbon
Lisbon, Portugal
Associate Editor
Biomechanical Engineering
University of Brescia
Brescia, Italy
Associate Editor
Micro- and Nanoelectromechanical Systems
UPR3346 Institut P' Recherche et Ingénierie en Matériaux, Mécanique et Energétique (Pprime)
Poitiers, France
Associate Editor
Tribology
University of California, Los Angeles
Los Angeles, United States
Associate Editor
Heat Transfer Mechanisms and Applications
Universitat Politecnica de Catalunya
Barcelona, Spain
Associate Editor
Biomechanical Engineering
Polytechnic University of Milan
Milan, Italy
Associate Editor
Micro- and Nanoelectromechanical Systems
National University of Singapore
Singapore, Singapore
Associate Editor
Digital Manufacturing
Harbin Institute of Technology, Weihai
Weihai, China
Associate Editor
Heat Transfer Mechanisms and Applications
University of Science and Technology Houari Boumediene
Bab Ezzouar, Algeria
Associate Editor
Turbomachinery
Polytechnic University of Turin
Turin, Italy
Associate Editor
Vibration Systems
University of Science and Technology (UTP)
Bydgoszcz, Poland
Associate Editor
Biomechanical Engineering
National Research Council (CNR)
Roma, Italy
Associate Editor
Tribology
University of Parma
Parma, Italy
Associate Editor
Engine and Automotive Engineering
Wuhan University
Wuhan, China
Associate Editor
Solid and Structural Mechanics