david lambertin
naarea
Nanterre, France
Associate Editor
Structural Materials
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Associate Editors
w.h. lee
Sejong University
Seoul, Republic of Korea
Associate Editor
Structural Materials
chengbao liu
Suzhou University of Science and Technology
Suzhou, China
Associate Editor
Semiconducting Materials and Devices
qing-feng liu
Shanghai Jiao Tong University
Shanghai, China
Associate Editor
Structural Materials
francesco paolo la mantia
National Interuniversity Consortium for Materials Science and Technology
Florence, Italy
Associate Editor
Polymeric and Composite Materials
wei-chih lai
Department of Photonics, College of Science, National Cheng Kung University
Tainan, Taiwan
Associate Editor
Semiconducting Materials and Devices
kwok-ho lam
Hong Kong Polytechnic University
Kowloon, Hong Kong, SAR China
Associate Editor
Smart Materials
sviatlana lamaka
Helmholtz Centre for Materials and Coastal Research (HZG)
Geesthacht, Germany
Associate Editor
Environmental Degradation of Materials
xin lan
Harbin Institute of Technology
Harbin, China
Associate Editor
Smart Materials
karin larsson
Uppsala University
Uppsala, Sweden
Associate Editor
Semiconducting Materials and Devices
jean-briac le graverend
Texas A and M University
College Station, United States
Associate Editor
Mechanics of Materials
nicolas le moigne
Mines-Telecom Institute Alès
Alès, France
Associate Editor
Polymeric and Composite Materials
frédéric charles lebon
Aix-Marseille Université
Marseille, France
Associate Editor
Mechanics of Materials
gwan-hyoung lee
Seoul National University
Seoul, Republic of Korea
Associate Editor
Thin Solid Films
han eol lee
Jeonbuk National University
Jeonju, Republic of Korea
Associate Editor
Semiconducting Materials and Devices
jung-kun lee
University of Pittsburgh
Pittsburgh, United States
Associate Editor
Thin Solid Films