jude iroh
University of Cincinnati
Cincinnati, United States
Associate Editor
Polymeric and Composite Materials
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Associate Editors
hatsuo ishida
Case Western Reserve University
Cleveland, United States
Associate Editor
Polymeric and Composite Materials
mahbub islam
Wayne State University
Detroit, United States
Associate Editor
Energy Materials
mohammad islam
Hemlock Semiconductor Operations
Hemlock, United States
Associate Editor
Energy Materials
dmitry s ivanov
University of Bristol
Bristol, United Kingdom
Associate Editor
Mechanics of Materials
han-yong jeon
Inha University
Incheon, Republic of Korea
Associate Editor
Structural Materials
joshua a jackman
Sungkyunkwan University
Jongno-gu, Republic of Korea
Associate Editor
Colloidal Materials and Interfaces
dongchan jang
Korea Advanced Institute of Science and Technology (KAIST)
Daejeon, Republic of Korea
Associate Editor
Mechanics of Materials
michael p. m. jank
Fraunhofer Institut für Integrierte Systeme und Bauelementetechnologie IISB
Erlangen, Germany
Associate Editor
Semiconducting Materials and Devices
anderson janotti
University of Delaware
Newark, United States
Associate Editor
Semiconducting Materials and Devices
daniel jauregui-vazquez
University of Guanajuato
Guanajuato, Mexico
Associate Editor
Smart Materials
junyi ji
Sichuan University
Chengdu, China
Associate Editor
Carbon-Based Materials
qingqing ji
ShanghaiTech University
Shanghai, China
Associate Editor
Thin Solid Films
shouxun ji
Brunel University London
Uxbridge, United Kingdom
Associate Editor
Structural Materials
songbai ji
Worcester Polytechnic Institute
Worcester, United States
Associate Editor
Mechanics of Materials
vincent ji
Université Paris-Saclay
Saint Aubin, France
Associate Editor
Mechanics of Materials